產品名稱 : WLPM-H22 Alder Lake Core™ 21.5" (Comming Soon)
產品描述
  • Intel® 12th / 13th / 14th Gen Core™  Processors, 65W
  • Modular Design with 21.5" 1920x1080 LCD Panel

  • Full Flat Res. or P-Cap Touch
  • Fanless Solution
  • IP66 Front Panel Mount Housing
  • Wide Range DC Input
  • TPM2.0 (On Board IC)
  • Optional WLAN with External Antenna
  • CE, FCC, VCCI Class B Passed
  • Adjust Brightness Function
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產品介紹
  • High Computing Power
  • Modular Design
  • Fanless w/ Smart Thermal Control
  • Flexible Configuration for Easy Control
Specification
ModelWLPM-H22 MBKFTWLPM-H22 MBKPT
Main System
CPU / Chipset Intel® 12th / 13th / 14th Gen Core™ Processors, 65W //  Intel® W680
Graphic Intel® UHD Graphic
RAM Dual Channel DDR5 4800/5600 MHz ,up to 96GB (48GB per DIMM)
TPM TPM2.0
OS Support Optional Win 10 IoT Enterprise, Win 11 IoT Enterprise GAC, Win 10 Pro, Win 11 Pro
Main System
Size 21.5”  16:9
Resolution (pixel) 1920 x 1080 (Full HD)
Number of Colors 16.7M colors
View Angle (H/V) 178(H) / 178(V)
Brightness(cd/m², nit) 250 nits
Contrast Ratio 1000:1 (Typ)
Touch Panel
Type Full flat resistive touch panel Full flat projected capacitive touch panel
Light Transmission 80 ± 5% >=86%
Hardness >=3H >=7H
Lifetime 35M times 100M times
Storage & Expansion
Storage 1 x M.2 (Key M, 2242/2280) with PCIe Gen4 x4 for SSD
1 x M.2 (Key M, 2242) with PCIe Gen3 x4 and SATA3 for SSD
Expansion 1 x M.2 (Key B, 3042/3052) with PCIex1, USB3.2 Gen I, USB2.0 and SIM for 4G/5G
1 x M.2 (Key E, 2230) with PCIex1, USB2.0 and CNVi for Wireless
1X PCI-E x 16 expansion slot
I/O Ports
USB 2 x USB 2.0, 4 x USB 3.2 Gen II
COM 2 x RS-232/422/485 (COM1, COM2), 1 x RS-232 (COM3)
LAN 1 x RJ-45 2.5 Gbps, 1 x RJ-45 1.0 Gbps (Support Vpro)
HDMI 1 x DP 1.4a++ ; 1 x HDMI 2.0b ,1 x HDMI 1.4b
Audio 2 x 3.5mm phone jack connector (Line-out, Mic-in)
Control Keys Rear bottom: Power on /off
Power
Power input ATX PWR (24+8-pin)
Power adapter Internal, 400 watts, AC input 115 ~230V, 47~63 Hz
Environmental
Temperature Operating Temperature:
0~50℃ (IEC60068-2-56, air flow cooling)
Storage Temperature: -20~60℃
Humidity Operating & Storage: 10 ~ 90%, non-condensing
IP / IK Level IP66 at front, IK05
Mechanical Characteristics
Housing Front bezel is Aluminum, others are SECC with black coating
Dimensions (Net: mm) TBD
Weights (Net: kg) TBD kg
Mounting Panel mount / VESA (75x75)
Certification FCC-B, CE (EMC), VCCI, ICES-003
Options & Customization

Major Options

Options

1. Wireless and BT kit (2 ant)
2. Projected capacitive touch screen
3. Stainless front bezel
4. Windows 11 IoT Enterprise LTSC
5. Windows 10 IoT Enterprise LTSC
6. USB 2.0 X 2
7. Chassis type housing
8. 2.5” SSD
9. RTX-A4000 Ada/ A1000 Ada
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